The QOOL CHIPS® is your answer to the growing megatrends in telecom and datacom, cooling of 5G wireless amplifiers, IoT, and 3D sensing and LiDAR.
These advanced, hermetically sealed, solid-state microcoolers offer unrivaled, high-efficiency cooling performance with couple densities >1000 couples/cm2 and device as thin as 0.5mm.
These devices are designed for precision temperature control of optoelectronics components in Telecom, Datacom, and LiDAR applications.
- Built on a unique hermetically sealed technology platform allowing for use in non hermetic packaging
- Incorporates industry best highest efficiency materials to provide exceptional cooling capability on top of reliable mechanical integrity
- Utilizes structures in tandem with robust fault tolerant topology for unparallel reliability
- Data communications
- 5G Communications
- Data Center
- LIDAR/3D Sensing
- CCD, IR, Sensors
- Medical Diagnostics/PCR