CENTUM Advanced Solid-State Coolers

Unrivaled Cooling Performance, Robust Mechanical Integrity, Patented Device Structures


Sheetak’s flagship CENTUM® product line offers a patented multi-stage thermoelectric device architecture with industry best metrics in ΔT, Cooling Power (Qc) and COP in a compact and low-profile chip package.

The CENTUM® product line utilizes industry-best materials to provide exceptional cooling capability and includes many options in size and cooling power. Options are available for enhance performance and reliability such as solder free attachments, CVD coatings, temperature cycling substrates, and fault tolerance designs.


  • Patented multi-stage architecture
  • Industry-best temperature differentials ΔT >115°C @ Th=50 °C
  • High Cooling Power and COP metrics
  • Options for solder free, CVD sealants, temperature cycling, and fault tolerant designs
  • Low profile and Compact form factor
  • High reliability and MTBF>100,000 cycles


  • Optoelectronics
  • Telecommunications
  • Semiconductor Test and Measurement
  • Thermo-cyclers for medical Diagnostics/PCR
  • High Performance Computing
  • Refrigeration/Heat Pumps
  • Automotive
  • Defense & Aerospace


  • 5G Communications
  • Data Center Cooling
  • LIDAR/3D Sensing
  • Imaging CCD/IR/Sensors
  • Battery Cooling
  • Additive Manufacturing
  • A/C for Electric Vehicles